| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device which can reduce the vibration caused by polishing resistance and, which can miniaturize the whole of the device, and which can lighten a weight. SOLUTION: In the polishing device 1 comprising a pad holder 6 to which a polishing pad 28 is fixed, and which can move in parallel with a workpiece and rotate around the workpiece, and a polishing head spindle (head section) 4, for rotatably holding a workpiece holding section (wafer holding section) 14, which holds a wafer (workpiece) 12, and applying pressure to the pat holder 6 and the workpiece holding section 14 to make them contact each other and polishing the wafer 12 by rotating the workpiece holding section 14, a weight (object) 18 which can rotate along the external periphery of the polishing head spindle 4, is arranged in the polishing head spindle 4, and the wafer 12 is polished by rotating the weight 18 so as to restrain the vibration of the polishing head spindle 4. |
