| 摘要 |
A structure comprises a substrate with electronic components formed on a first surface of the substrate. The structure includes a scribe line on a first surface of the substrate. The structure includes a trench formed by a laser on the second or back-side surface of the substrate, thus protecting the front-side surface of the substrate and, more particularly, the electronic component such as an integrated circuit and/or functional unit on the front-side surface of the substrate during singulation. Since, according to the invention, no saw blade is used, the width of the scribe line does not need to be any larger than the width of the beam from the laser plus some minimal tolerance for alignment. As a result, using the invention, the width of scribe line is on the order of twenty-four times smaller than the width of scribe lines required by the prior art methods. |
