| 摘要 |
PROBLEM TO BE SOLVED: To provide a resist composition and a pattern forming method thereto which can exhibit enough resolution in the ordinary pattern formation, reduce the pattern size by flow baking, and provide easy control of flow amount. SOLUTION: The chemical amplification type positive type resist composition for thermal flow comprises a specific hydroxyl-styrene resin (A) of which the 10 to 50 mol.% of hydroxyl groups are replaced with acid decomposable groups, the weight average molecular weight of 5,000 to 50,000, and the degree of dispersion of 1.0 to 1.3, a specific hydroxyl-styrene resin (B) of which the 10 to 50 mol.% of hydroxyl groups are replaced with acid decomposable groups and the weight average molecular weight of 5,000 to 50,000, and a photoacid generation agent. |
