| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for securely removing an icicle. SOLUTION: A flow solder apparatus is provided with a solder tank 12 storing molten solder, a jet forming part 20 forming a jet swelled from the liquid level of molten solder stored in the solder tank 12, a transportation part for moving a printed board 30 in one direction at a height where the jet arrives at the lower face of the printed board 30, an icicle removing board 60 arranged at the back of the jet forming part 20 in a transportation direction and a heating means 16 for heating the icicle removing board 60. The icicle removing board 60 is arranged in a position higher than the liquid level of molten solder stored in the solder tank 12. A through hole group passing through the icicle removing board 60 and a projection group protruded to a level higher than the entrance of the through hole group are alternately arranged adjacently to a horizontal direction. |
