PACKAGE STRUCTURE OF SEMICONDUCTOR ELEMENTS AND LIQUID CRYSTAL DISPLAY DEVICE HAVING THE STRUCTURE

摘要

PROBLEM TO BE SOLVED: To prevent a short circuit from occurring across a connection pad or leader wiring and a bump electrode of a semiconductor element in a COG package of a liquid crystal display device. SOLUTION: In a connection pad structure for a COG package, an upper layer conductive film 12 is made smaller than a lower layer conductive film 9 and made larger than an opening 11 of an insulating film 10 in shape, and thereby the insulating part is exposed to step parts 10a, 10b to be formed on the periphery of the lower layer conductive film 9.