发明名称 SUBSTRATE PROCESSING METHOD AND ITS APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing method which can drastically improve a reaction rate of a substrate surface treatment by a treated solution, and its apparatus. SOLUTION: In the substrate processing apparatus of this invention having a processor which processes the surface treatment of a substrate W reacting a treated solution (e.g. ozone water), in which a gas (e.g. ozone) is dissolved, to the substrate W, the processor comprises a substrate temperature up unit 5 raising the substrate temperature to a predetermined higher temperature than that of the ozone water, and a processing tank 1 which processes the surface treatment of the substrate W reacting the ozone water to the substrate W of which the temperature is raised by the substrate temperature up unit 5.
申请公布号 JP2002198347(A) 申请公布日期 2002.07.12
申请号 JP20000397351 申请日期 2000.12.27
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 FUJIKAWA KAZUNORI
分类号 B08B3/02;H01L21/027;H01L21/304;H01L21/306;(IPC1-7):H01L21/304 主分类号 B08B3/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利