| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board for mounting semiconductor devices, which can achieve high density mounting and fine wiring, corresponding to the increase in the number of terminals and the narrowing of a pitch of a semiconductor device, achieve the narrow pitch of an external electrode corresponding to the miniaturization and increased density of a system, and has improved packaging reliability. SOLUTION: The wiring board for mounting semiconductor devices comprises an insulating layer, wiring provided on the upper surface of the insulating layer, an electrode that is provided at the lower surface side of the insulating layer while at least the periphery of the side surface of the upper end of the electrode comes into contact with the insulating layer, and at least the lower surface of the electrode does not come into contact with the insulating layer, a via that is positioned on the upper surface of the electrode and provided in the insulating layer for connecting the electrode to the wiring, and a support that is provided on the surface of the insulating layer.
|
