MULTI CHIP PACKAGE WITH MICROWAVE BAND USING GLASS SUBSTRATE

摘要

PURPOSE: A multi chip package with microwave band using glass substrate is provided to directly emit a heat occurred in a chip by arranging a heat sink to a multi chip package and an upper portion of a multi chip when forming the multi chip package. CONSTITUTION: One or more flip chip(54) is a multi chip package through a solder bumper(56). A metal line(52) for connecting an input/output signal line, a power line, and a ground line to the outside is formed on a glass substrate(51). A connecting line(53) for connecting flip chip(54) each other is formed on the glass substrate(51). A heat sink(58) is installed on the flip chip(54) using a binding material(57) for transmitting a heat occurred in the flip chip(54) to the outside. A plane inductor and a chip inductor are simultaneously formed on the glass substrate(51).