发明名称 SEMICONDUCTOR INTEGRATED-CIRCUIT DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To integrate a diode element with satisfactory efficiency regarding the diode element whose breakdown strength in its turn-off operation is enhanced in a semiconductor integrated-circuit device with a built-in spark killer diode suitable for protecting the output transistor. SOLUTION: In the semiconductor integrated-circuit device, a first P+ type buried layer 35 formed as an anode region and an N+ type diffusion region 41 formed in a cathode region are formed so as to be separated in the depth direction. When a reverse bias is applied to the diode element 21, a depletion- layer formation region can be obtained in an N-type region which is composed of a first epitaxial layer 25 and a second epitaxial layer 26 in a P-N junction, the breakdown strength of the diode element is ensured by a depletion layer formed at this time, and it is possible to restrain the breakdown of an internal element due to a breakdown current.
申请公布号 JP2002198541(A) 申请公布日期 2002.07.12
申请号 JP20000392221 申请日期 2000.12.25
申请人 SANYO ELECTRIC CO LTD 发明人 OKAWA SHIGEAKI;OKODA TOSHIYUKI
分类号 H01L29/73;H01L21/331;H01L21/8222;H01L27/06;H01L29/08;H01L29/861;(IPC1-7):H01L29/861;H01L21/822 主分类号 H01L29/73
代理机构 代理人
主权项
地址