| 摘要 |
<p>The interconnecting module for the base of an electronic equipment housing offsets, in relation to the faces of the printed circuit boards (4, 5) that support the equipment components housed in the casing, a field of connection points to the exterior of the casing embodied by the rear ends of the pins of a semi-connector (3) fixed to the back of the casing, while still retaining the compactness of the casing despite the large number of connection points with the exterior of the casing (several hundred). Said module takes the form of three panels with a central panel (7), fixed to the rear end of the pins of the semi-connector (3) which is mounted to the back of the casing and two lateral panels (8, 9), folded up and attached to each other, connected to the longitudinal edges of the central panel (7) by pieces of flexible printed circuit (10, 11) and supporting the field of connection points offset from the faces of the boards (4, 5) of the electronic equipment. Electronic connections link the two fields of connection points via the joining parts (10, 11).</p> |
