| 摘要 |
<p>An apparatus and a method for abrading the outer circumferential part or the notched part of a semiconductor wafer with high accuracy. The apparatus A for abrading a semiconductor wafer comprises a mechanism for mounting a stack of semiconductor wafers on a turntable in a tank filled with abrasive slurry and turning an abrasive roller wound around the outer circumferential surface thereof with an abrasive pad of soft elastic material while facing the outer circumferential part of the semiconductor wafer. The apparatus for abrading a semiconductor wafer further comprises a mechanism for placing a stack of semiconductor wafers in the abrasive slurry tank while aligning the positions of the notched parts and turning an abrasive belt having cross-sectional shape identical to that of the notched part while facing the notched part. The abrasive pad and abrasive belt are made of a soft elastic material of 7(Hs)-40(Hs).</p> |
