| 发明名称 |
Plating bath |
| 摘要 |
Disclosed are electroplating baths for enhancing copper seed layers and for subsequent metallization on the seed layers. Methods of enhancing copper seed layers and depositing metal on such seed layers are also disclosed.
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| 申请公布号 |
US2002090484(A1) |
申请公布日期 |
2002.07.11 |
| 申请号 |
US20010981852 |
申请日期 |
2001.10.17 |
| 申请人 |
SHIPLEY COMPANY, L.L.C. |
发明人 |
MERRICKS DAVID;MORRISSEY DENIS;BAYES MARTIN W.;LEFEBVRE MARK;SHELNUT JAMES G.;STORJOHANN DONALD R. |
| 分类号 |
C25D3/38;C25D5/48;C25D7/12;H01L21/288;H01L21/768;(IPC1-7):B32B3/26;C25D5/00;C25D5/02;H01L21/20;H01L21/44;H01L21/445 |
主分类号 |
C25D3/38 |
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