CARRIER FOR FABRICATING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A carrier for fabricating a semiconductor package is provided to perform each process for fabricating the semiconductor package regarding a strip unit of the semiconductor package, by receiving members for fabricating the semiconductor package of a single unit while the members can be separated so that the members are disposed by a strip unit. CONSTITUTION: A plurality of receiving holes(12) are formed in a body part(32). An open/shut plate(16) is hinge-coupled to an end of the body part so that the open portion at a side of the respective receiving holes is opened/shut. A slide groove(14) is formed on the inner surface of the respective receiving holes. A slide groove is formed on the inner surface of the open/shut plate.