| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device capable of realizing the cost reduction of an electrical characteristic test and that of a product by using existing test jigs and testing devices, and provide a carrier used for it. SOLUTION: During a burn-in test in manufacturing a memory product or a microcomputer/logic product, a chip 1 is so inserted into a through hole 6 of a base 4 as to direct its electrodes downward, a lid 5 is closed, and thereafter, the carrier 2 with the chip 1 mounted is inserted into a socket 3 on a burn-in board, and the burn-in test of the chip 1 mounted in the carrier 2 is executed in this condition. A tape circuit board 8 having interchangeability with a package in the arrangement and signal assignment of terminals 11 connected to contact parts 10 is used for the carrier 2, so that an existing burn-in board and the like can be used as they are. The carrier 2 used in the burn-in test is used in a selection test as well.
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