发明名称 POLYAMIDE RESIN-CONTAINING VARNISH AND ITS USE
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin-containing composition, particularly a composition suited in use for a varnish which is easy to remove a solvent on forming a film and can obtain a film and an adhesive bond with reduced residual solvent. SOLUTION: The polyamide resin-containing varnish comprises a phenolic hydroxyl group-containing aromatic polyamide resin and, as the solvent, a cycloalkane as the essential components, and preferably further comprises a curable resin.
申请公布号 JP2002194282(A) 申请公布日期 2002.07.10
申请号 JP20010321356 申请日期 2001.10.19
申请人 NIPPON KAYAKU CO LTD 发明人 IMAIZUMI MASAHIRO;ASANO TOYOFUMI;NIIMOTO HARUKI
分类号 C08G69/26;C09D153/00;C09D177/00;C09D177/06;C09D177/10;C09J7/02;C09J153/00;C09J177/00;C09J177/06;C09J177/10;H01L23/498;H05K1/03;(IPC1-7):C09D177/06 主分类号 C08G69/26
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