摘要 |
PURPOSE: A SAW(Surface Acoustic Wave) device is provided to increase a ground surface of the SAW by electrically connecting an outer shielding part with the ground. CONSTITUTION: A SAW device comprises a substrate(20), metal thin films(21) formed on the substrate(20) so as to improve a conductivity of a device mounted on the substrate(20), bump balls(11) formed between the substrate(20) and a pad(10) to be connected with the metal thin films(21) for performing a transmission of an electrical signal, outer shielding parts(12) formed on the edge portions of the pad(10) to protect air cavities(A) formed when connecting the pad(10) and the substrate(20), an epoxy part enclosing the outer surfaces of the substrate(20) and pad(10) to make a capsule-type structure after connecting the pad(10) and the substrate(20). At this time, the outer shielding parts(12) is electrically connected to the ground through the metal thin films(21). |