| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in reflow resistance, and to provide a semiconductor device using the same composition. SOLUTION: The epoxy resin composition is composed of, as essential components, (A) an epoxy resin, (B) a phenol resin, (C) a curing promoter, (D) an inorganic filler, (E) a mold release agent and (F) an epoxidized-diene based block copolymer, wherein (D) the inorganic filler of 50-92 wt.% and (F) the epoxidized-diene based block copolymer of 0.05-10 wt.%, are contained to the whole of composition, and the semiconductor device using the above epoxy composition is provided.
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