发明名称 POLYAMIDE RESIN COMPOSITION AND PLASTIC MULTILAYER
摘要 <p>PROBLEM TO BE SOLVED: To provide a polyamide resin composition that is tightly adherable to a fluorine resin and does not cause or rarely causes defects such as overreaction at the adherence interface when a multilayer composite material of a fluororesin and a polyamide resin is manufactured. SOLUTION: This polyamide resin composition comprises (A) a polyamide wherein the mole ratio of the carboxyl end group to the amino end group is >1, (B) an aromatic diamine, and (C) a base with a pKa (25 deg.C) of >=10 or a salt thereof. The relative viscosity of the polyamide (A) (in 0.5 wt.% m-cresol solution at 25 deg.C) is, for example, on the order of 1.9-2.7. A cyclic amine or a salt thereof can be used as the base or a salt thereof (C).</p>
申请公布号 JP2002194210(A) 申请公布日期 2002.07.10
申请号 JP20000391893 申请日期 2000.12.25
申请人 DAICEL DEGUSSA LTD 发明人 ARITA HIROAKI;SHIMIZU TAKUMI
分类号 F16L11/04;B32B27/30;B32B27/34;C08K3/00;C08K5/17;C08L77/06;F16L11/127;(IPC1-7):C08L77/06 主分类号 F16L11/04
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