发明名称 |
PREPREG AND METAL FOIL CLAD LAMINATED PLATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg free from a halogen and having good solder heat resistance characteristic and free from unevenness in appearance, and also provide a laminated plate. SOLUTION: The prepreg is produced by a process comprising immersing into or applying to a substrate a composition in which aluminium hydroxide (A) and aluminum hydroxide (B) having water of crystallization partially reduced by heating and weight decreasing rate of 22-32% by TGA are included in a thermosetting resin (D) as an essential component. A laminated plate for a print wiring material or a metal foil clad laminated plate is obtained by curing the prepreg.
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申请公布号 |
JP2002194119(A) |
申请公布日期 |
2002.07.10 |
申请号 |
JP20000390692 |
申请日期 |
2000.12.22 |
申请人 |
MITSUBISHI GAS CHEM CO INC |
发明人 |
KATO SADAHIRO;MISHIMA HIROYUKI;TOKI MASANOBU;NAGAI KEN |
分类号 |
C08J5/24;C08K3/22;C08K5/54;C08K5/541;C08K9/00;C08L35/00;C08L63/00;C08L79/04;C08L101/00;H05K1/03;(IPC1-7):C08J5/24 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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