发明名称 PREPREG AND METAL FOIL CLAD LAMINATED PLATE
摘要 PROBLEM TO BE SOLVED: To provide a prepreg free from a halogen and having good solder heat resistance characteristic and free from unevenness in appearance, and also provide a laminated plate. SOLUTION: The prepreg is produced by a process comprising immersing into or applying to a substrate a composition in which aluminium hydroxide (A) and aluminum hydroxide (B) having water of crystallization partially reduced by heating and weight decreasing rate of 22-32% by TGA are included in a thermosetting resin (D) as an essential component. A laminated plate for a print wiring material or a metal foil clad laminated plate is obtained by curing the prepreg.
申请公布号 JP2002194119(A) 申请公布日期 2002.07.10
申请号 JP20000390692 申请日期 2000.12.22
申请人 MITSUBISHI GAS CHEM CO INC 发明人 KATO SADAHIRO;MISHIMA HIROYUKI;TOKI MASANOBU;NAGAI KEN
分类号 C08J5/24;C08K3/22;C08K5/54;C08K5/541;C08K9/00;C08L35/00;C08L63/00;C08L79/04;C08L101/00;H05K1/03;(IPC1-7):C08J5/24 主分类号 C08J5/24
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