发明名称 |
Implantation process using sub-stoichiometric, oxygen doses at different energies |
摘要 |
The present invention provides a method for creation of high quality semiconductor-on-insulator structures, e.g., silicon-on-insulator structures, using implantation of sub-stoichiometric doses of oxygen at multiple energies. The method employs sequential steps of ion implantation and high temperature annealing to produce structures with a top silicon layer having a thickness ranging from 10-250 nm and a buried oxide layer having a thickness 30-300 nm. The buried oxide layer has a breakdown field greater than 5 MV/cm. Further, the density of silicon inclusions in the BOX region is less than 2x107 cm-2. The process of the invention can be used to create an entire SOI wafer, or be used to create patterned SOI, regions where SOI regions are integrated with non-SOI regions.
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申请公布号 |
US6417078(B1) |
申请公布日期 |
2002.07.09 |
申请号 |
US20000748526 |
申请日期 |
2000.12.21 |
申请人 |
IBIS TECHNOLOGY CORPORATION |
发明人 |
DOLAN ROBERT P.;CORDTS, III BERNHARDT F.;ANC MARIA J.;ALLES MICAHEL L. |
分类号 |
H01L21/265;H01L21/02;H01L21/762;H01L27/12;(IPC1-7):H01L21/76 |
主分类号 |
H01L21/265 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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