发明名称 |
Solder powder and method for preparing the same and solder paste |
摘要 |
An organic acid salt is deposited on the surface of a solder powder containing Sn and Zn. Alternatively, 0.5 to 10 wt. % of a nonionic surfactant is added to a flux. By a method comprising such a procedure, provided are a lead-free solder powder and solder paste having good soldering characteristics wherein the reaction of an activating component with an alloy component in a flux is suppressed.
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申请公布号 |
US6416590(B1) |
申请公布日期 |
2002.07.09 |
申请号 |
US20000720722 |
申请日期 |
2000.12.28 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HIRATA MASAHIKO;OHASHI TAKASHI;YOSHIDA HISAHIKO;NOGUCHI HIROJI;HISAZUMI TAKAO;SENNA MAMORU;ISOBE TETSUHIKO |
分类号 |
B23K35/02;B23K35/14;B23K35/36;H05K3/34;(IPC1-7):B22F1/02 |
主分类号 |
B23K35/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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