| 摘要 |
PURPOSE: Provided is a photoresist composition which can be processed at relatively low temperature by using a high molecular weight compound incorporating crosslinkage without necessity of a separate crosslinking agent. CONSTITUTION: The photoresist composition comprises (1) 100 parts by weight of high molecular weight compounds having molecular weight of 7000-50000 of formula 1, which is obtained by incorporating a bisphenol-A diethanoldivinyl ether or 1,4-cyclohexane dimethanol divinyl ether, as crosslinking agent, between molecules of hydroxystyrene/styrene/t-butylacrylate copolymer or hydroxystyrene/styrene/ t-butylmethacrylate copolymer to crosslink the molecules; (2) 0.1-20 parts by weight of photosensitizer of formula 5; (3) 0.01-10 parts by weight of organic base; and (4) 500-1000 parts by weight of organic solvent. In the formulae, R1 represents hydrogen atom or methyl group, R2 represents t-butyl group or methyl group, R3 is methyl group, X is the formula a or b, each of l, m, and n is an integer satisfying formulae 0.05<=m/l<=0.5 and 0.05<=n/l<=0.5, Q- represents nonaflate or 10-camphorsulfonate, and Me is methyl group. |
