| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrasonic vibration welding apparatus for reducing ultrasonic vibration components, in the vertical direction of the ultrasonic horn of a horizontal vibration system as much as possible, avoiding damages to a chip component, taking a path line between the peripheral chip component on a circuit board and improving the working of ultrasonic welding. SOLUTION: This ultrasonic vibration welding apparatus for utilizing the ultrasonic horn of the horizontal vibration system and ultrasonic-welding and mounting the bump of the chip component 24 to the land part of the circuit board 23 is provided with the ultrasonic horn 1 which is provided with suction and supporting surface 2 of the chip component 24, an ultrasonic vibration generator 4 for horizontally vibrating the ultrasonic horn 1, together with the chip component held by the suction and supporting surface 2 and a nodal support resonance supporting bar 7, composed of the same frequency resonance body as the ultrasonic horn and connected to a nodal point 1a to be the vibration nodal point of the ultrasonic horn 1 to be held. The ultrasonic horn 1 is turned into an attitude of being inclined obliquely upwardly forward the circuit board 23 and the ultrasonic welding which does not generate vertical vibration in the chip component 24 is made possible.
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