发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE |
摘要 |
PURPOSE: A method for manufacturing a semiconductor package is provided to minimize a damage of a heat sink on a manufacturing process and to largely reduce a manufacturing cost. CONSTITUTION: A plurality of wiring patterns including a ball land(4) is formed on a circuit substrate unit(2). A circuit substrate strip(1) divided by a slot(5) as a border is formed by connecting the circuit substrate unit. Each heat sink unit(6) is attached to one side of each circuit substrate unit. After installing a semiconductor chip to each circuit substrate unit, the chip is connecting to the circuit substrate with a conductive wire. The chip and the conductive wire are encapsulated by a molding material. A conductive ball is melted on the ball land in the wiring pattern formed on each circuit substrate unit. Each semiconductor package is separated by sawing a circuit substrate strip into each circuit substrate unit. |
申请公布号 |
KR20020053423(A) |
申请公布日期 |
2002.07.05 |
申请号 |
KR20000083055 |
申请日期 |
2000.12.27 |
申请人 |
AMKOR TECHNOLOGY KOREA, INC. |
发明人 |
CHO, EUNG SAN;LEE, JAE JIN;MUN, DU HWAN |
分类号 |
H01L23/36;(IPC1-7):H01L23/36 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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