| 发明名称 |
COMPOSITE MATERIAL AND CIRCUIT BOARD |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite material having a composition different from conventional composite material and exhibiting excellent thermal conductivity and moldability. SOLUTION: The composite material is composed of 2-90 pts.wt. of a polyphenylene sulfide resin and 98-10 pts.wt. of calcium fluoride particles.
|
| 申请公布号 |
JP2002188007(A) |
申请公布日期 |
2002.07.05 |
| 申请号 |
JP20000389489 |
申请日期 |
2000.12.21 |
| 申请人 |
HITACHI METALS LTD;HITACHI METALS MAGTECH CO LTD;HITACHI METALS TRADING CO LTD |
发明人 |
MIMORI YOSHIMI;TAWARA KAZUNORI;SAWADA RYOZO;KOTOJI MORIO |
| 分类号 |
C08L81/02;C08K3/00;C08K3/16;C08K7/04;C08K7/16;C08L101/00;H05K1/03;(IPC1-7):C08L81/02 |
主分类号 |
C08L81/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
