| 摘要 |
PURPOSE: An apparatus for inspecting an interface delamination of semiconductor packages is provided to exactly inspect an interface delamination of semiconductor packages by automatically overturning a strip having a plurality of semiconductor packages in a water tank. CONSTITUTION: An apparatus for inspecting an interface delamination of semiconductor packages is constituted of a strip(30) having a plurality of semiconductor packages, clamps(65) for clamping the strip(30) at each end of the strip(30) in order to rotate the strip(30), a water tank(20) for supporting the clamps(65) inside, in which water is filled at a predetermined level in order to inspect the interface delamination of the semiconductor package in the strip(30), a motor(40) for rotating the clamps(65), which is disposed out of the water tank(20), a controller(50) for outputting control signals relating to a rotating direction and a rotation time of the motor(40), and a non-fracture inspection device for outputting signals requiring for a rotation of the strip(30) to a transducer(10) after an ultrasonic inspection, which is associated with the controller(50). |
