发明名称 |
Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth |
摘要 |
Semiconductor packaging methods, systems and apparatus for semiconductor lasers to achieve high modulation bandwidth. Systems, methods and apparatus for minimizing the inductance of wire bond interconnects and impedance matching in a semiconductor laser package. Systems, methods and apparatus for monitoring a photocurrent in order to provide automatic power control (APC) of a semiconductor laser.
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申请公布号 |
US2006192221(A1) |
申请公布日期 |
2006.08.31 |
申请号 |
US20060409938 |
申请日期 |
2006.04.24 |
申请人 |
JDS UNIPHASE CORPORATION |
发明人 |
ZHOU MICHAEL;SUN DIE-CHI;TAN KEE-SIN;JIANG WENBIN |
分类号 |
H01S3/04;H01L29/22;H01L31/12;H01L33/00 |
主分类号 |
H01S3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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