SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to improve a heatsink property and to use interposers relatively having a thin thickness by installing a heat spreader having a good thermal conductivity between semiconductor chips. CONSTITUTION: A semiconductor package comprises a substrate(2), such as a PCB(Printed Circuit Board) or a lead frame, a first semiconductor chip(4) is stick to the center portion of the substrate(2) using an adhesive part(12), such as an epoxy adhesive or an adhesive film, a number of input/output pads(4a) formed on the edge portion of the first semiconductor chip(4), a second semiconductor chip(6) having a number of input/output pads(6a) mounted on the first semiconductor chip(4), and a heat spreader formed with interposers(18) on the upper and lower portions installed between the first and second semiconductor chips(4,6).