| 摘要 |
Electronic component comprises a semiconductor chip (2) with copper conducting pathways (3) for connecting semiconductor electrode surfaces (4) of elements of the chip to copper contact surfaces (6). Connecting lines (7) extend from the contact surfaces to the connecting surfaces (8) of a system support (9). The contact surfaces have a connecting line coated with residues of an organic protective layer in regions of the contact surface. An Independent claim is also included for a process for the production of an electronic component. Preferred Features: The conducting pathways and the contact surfaces are made from a copper alloy containing silicon. The protective layer is made from a polymer and/or copolymer, disproportionated pine resin, esterified pine resin, phthalate resin, preferably dimethylglycol phthalate, or an imidazole derivative. |
