| 摘要 |
PURPOSE: A printed wiring board and a fabricating method thereof are provided to prevent the stress concentration due to deformation of the board. CONSTITUTION: A conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole(24) formed in a thermoplastic resin film(23). The resin film(23) interposes between conductor patterns(22) and is hot-pressed from both sides. When the metal particles contained in the conductive paste are sintered to form a unified conductive compound(51), the volume of the conductive paste shrinks. Synchronously, the resin film(23) around the via-hole(24) protrudes into the via-hole(24). Therefore, the shape of the side wall on the cross-section of the conductive compound provides an arch shape, and a side wall(51a) adjacent to a junction part(51b) of the conductive compound(51), which contacts the conductor pattern(22), is formed with an inclination. |
