| 摘要 |
Provided is an epoxy resin composition for encapsulating semiconductor devices, which shows an improved adhesion to a Cu lead frame, Ni-plated Cu lead frame and Ni/Pd-plated and Ag/Au-plated Cu lead frame, and thus increases the reliability of a semiconductor package. The epoxy resin composition for encapsulating semiconductor devices comprises an epoxy resin, a curing agent, a curing accelerant, an inorganic filler and a coupling agent, wherein the coupling agent includes a pyrrole-based silane coupling agent represented by the following formula 1. In the formula 1, R1 is a C1-C3 alkoxy group. The pyrrole-based silane coupling agent and the inorganic filler are used in an amount of 0.01-1 wt% and 82-92 wt%, respectively, based on the total weight of the epoxy resin composition.
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