发明名称 |
HEAT SINK ASSEMBLY RETAINER DEVICE |
摘要 |
A retainer device for fixing a heat sink (2) on a chip (4) includes a mounting frame (31), a base plate (33) and a mounting lever (32). The heat sink has a number of upwardly extending cooling fins (21) and a pair of securing outwardly extending flanges (23). The mounting frame includes a pair of retaining plates (312) for pressing against the securing flanges and a pair of spring plates (311) connecting the retaining plates. The retaining plate defines a clip (318) for engaging with the heat sink and a latch 317 on each end thereof. The base plate defines four receiving projections (331), each of which defines a notch (332) for receiving the latch. The mouning lever defines a base pole (321) received between the cooling fins. The base pole defines at least one protrusion (323) for pressing against the spring plates and the securing flanges.
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申请公布号 |
US2002085357(A1) |
申请公布日期 |
2002.07.04 |
申请号 |
US20010835932 |
申请日期 |
2001.04.10 |
申请人 |
YONEYAMA ATSUSHI;YU HUNG-CHI |
发明人 |
YONEYAMA ATSUSHI;YU HUNG-CHI |
分类号 |
H01L23/40;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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