发明名称 HEAT SINK ASSEMBLY RETAINER DEVICE
摘要 A retainer device for fixing a heat sink (2) on a chip (4) includes a mounting frame (31), a base plate (33) and a mounting lever (32). The heat sink has a number of upwardly extending cooling fins (21) and a pair of securing outwardly extending flanges (23). The mounting frame includes a pair of retaining plates (312) for pressing against the securing flanges and a pair of spring plates (311) connecting the retaining plates. The retaining plate defines a clip (318) for engaging with the heat sink and a latch 317 on each end thereof. The base plate defines four receiving projections (331), each of which defines a notch (332) for receiving the latch. The mouning lever defines a base pole (321) received between the cooling fins. The base pole defines at least one protrusion (323) for pressing against the spring plates and the securing flanges.
申请公布号 US2002085357(A1) 申请公布日期 2002.07.04
申请号 US20010835932 申请日期 2001.04.10
申请人 YONEYAMA ATSUSHI;YU HUNG-CHI 发明人 YONEYAMA ATSUSHI;YU HUNG-CHI
分类号 H01L23/40;(IPC1-7):H05K7/20 主分类号 H01L23/40
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