发明名称 |
Enhanced space utilization for enclosures enclosing heat management components |
摘要 |
An enclosure such as a notebook computer chassis in which the thermo-siphon devices are embedded in the skin of the enclosure is disclosed. The thermo-siphon devices include heat pipes. The thermo-siphon devices are use to absorb the heat dissipated by a heat source and dissipate it at a remote location.
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申请公布号 |
US2002085350(A1) |
申请公布日期 |
2002.07.04 |
申请号 |
US20000752245 |
申请日期 |
2000.12.28 |
申请人 |
GHOSH PROSENJIT |
发明人 |
GHOSH PROSENJIT |
分类号 |
G06F1/20;H05K7/20;(IPC1-7):G06F1/20;H05K5/00 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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