发明名称 Scalable dielectric
摘要 An interpoly dielectric is formed using only a single layer of oxide and a single layer of nitride to allow a reduction in thickness. The nitride is thermally grown on silicon in a nitrogen environment to maintain a high quality layer, while the oxide is deposited by LPCVD.
申请公布号 US2002084482(A1) 申请公布日期 2002.07.04
申请号 US20010008695 申请日期 2001.11.08
申请人 KAYA CETIN;CHEN MEN CHEE;SAN KEMAL TAMER 发明人 KAYA CETIN;CHEN MEN CHEE;SAN KEMAL TAMER
分类号 H01L21/28;H01L21/314;H01L21/316;H01L21/318;H01L29/51;(IPC1-7):H01L29/788 主分类号 H01L21/28
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