发明名称 |
Sputtering device |
摘要 |
A sputtering device that efficiently guides sputtering particles ejected from a target to a film deposition subject and prolongs the interval at which a stick preventive member requires replacement. The sputtering device 1 has a vacuum chamber in which a specified sputtering target is placed so as to face a substrate 4 that is also placed in the vacuum chamber 2, and deposits a film on a surface of the substrate 4 using sputtering particles 20 ejected from the sputtering target 6; and particle ejection sections 60 constructed so as to slope at a specified angle of 30° to 60° with respect to the surface of the substrate 4, and respectively facing each other in the shape of a funnel are provided on the sputtering target 6. Lines of magnetic force 13 run from an N pole of a magnet 7a arranged at a rear surface of the target 6 to an S pole of a magnet 7b arranged around the target 6.
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申请公布号 |
US6413392(B1) |
申请公布日期 |
2002.07.02 |
申请号 |
US20000599531 |
申请日期 |
2000.06.23 |
申请人 |
NIHON SHINKU GIJUTSU KABUSHIKI KAISHA |
发明人 |
SAHODA TSUYOSHI;UEHIGASHI TOSHIMITSU;HIGUCHI YASUSHI;NAKAJIMA KUNIAKI;KONDO TOMOYASU |
分类号 |
C23C14/34;C23C14/35;C23C14/56;H01J37/34;H01L21/203;(IPC1-7):C23C14/35 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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