| 摘要 |
PROBLEM TO BE SOLVED: To keep a height of a cream solder to be adhered on a wafer high, to make the cream solder get out from a mask hole smoothly, and to do without a reflowing system to be equipped additionally. SOLUTION: A heater 7 set on a wafer supporting table 6 heats the wafer 5 at a predetermined timing and to a predetermined temperature. On a top of a screen mask 3, a cover body 9 is set so as to shunt while a squeegee 1 is taking a printing action and to break over the screen mask 3 immediately after completion of the printing action of the squeegee 1. A suction system 10 for pumping out air from the inside at a proper timing and a cooling system 11 for pumping in cold air to the inside at a proper timing are connected to the cover body 9.
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