发明名称 |
Ceramic wiring substrate and method of producing the same |
摘要 |
Wiring substrate including an insulating substrate made of glass ceramics and having Young's modulus of 120 GPa or less, and a wiring circuit layer made of a high-purity metal conductor in concentration of 99% by weight or more formed on the surface of the insulating substrate and/or inside thereof. This wiring substrate may be a multi-layer wiring substrate that has a plurality of wiring circuit layers. The wiring circuit layer is preferably made of a metal foil.
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申请公布号 |
US6413620(B1) |
申请公布日期 |
2002.07.02 |
申请号 |
US20000607151 |
申请日期 |
2000.06.29 |
申请人 |
KYOCERA CORPORATION |
发明人 |
KIMURA TETSUYA;ONITSUKA KATSUHIKO;HAYASHI KATSURA;KAWAI SHINYA;NISHIMOTO AKIHIKO |
分类号 |
H05K1/03;H05K3/06;H05K3/20;H05K3/40;H05K3/46;(IPC1-7):B32B3/00 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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