发明名称 Ceramic wiring substrate and method of producing the same
摘要 Wiring substrate including an insulating substrate made of glass ceramics and having Young's modulus of 120 GPa or less, and a wiring circuit layer made of a high-purity metal conductor in concentration of 99% by weight or more formed on the surface of the insulating substrate and/or inside thereof. This wiring substrate may be a multi-layer wiring substrate that has a plurality of wiring circuit layers. The wiring circuit layer is preferably made of a metal foil.
申请公布号 US6413620(B1) 申请公布日期 2002.07.02
申请号 US20000607151 申请日期 2000.06.29
申请人 KYOCERA CORPORATION 发明人 KIMURA TETSUYA;ONITSUKA KATSUHIKO;HAYASHI KATSURA;KAWAI SHINYA;NISHIMOTO AKIHIKO
分类号 H05K1/03;H05K3/06;H05K3/20;H05K3/40;H05K3/46;(IPC1-7):B32B3/00 主分类号 H05K1/03
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