| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed wiring board which is uniform in thickness and its manufacturing method, where a conductor pattern can be given interlayer continuity through a simple method, and a plating layer used for forming a pattern is not required to be controlled in thickness. SOLUTION: This manufacturing method comprises a first process of forming a conductor pattern 2 equipped with first conductive pads 20 on the surface of a carrier 3 where a metal layer 22 has been formed, a second process of forming an insulating resin layer 1 on the surface of the metal layer 22, a third process of forming viaholes 5 where the first conductive pads 20 serve as their bottoms respectively, a fourth process of obtaining a laminated board 84 by feeding conductive material into the viaholes, a fifth process of laminating the other wiring board 83 equipped with second conductive pads 70 positioned corresponding to the viaholes 5 on the laminated board 84 and cured by application of pressure, and a sixth process of removing the carrier and the metal layer.</p> |
