| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing chip-type solid electrolytic capacitor with which application of an insulation resin can be made easily executable, and at the same time, the manufacturing process of a chip-type solid electrolytic capacitor can be simplified. SOLUTION: In this method, a chip-type solid electrolytic capacitor 1, which is provided with capacitor elements 2 each of which being constituted by successively laminating a dielectric oxide coating film, an electrolytic layer, and a cathode layer upon an anode body, having an anode leading-out wire 4 and composed of a valve-action metal so that the cathode layer is turned into a packaging layer, a packaging resin 3 which covers the elements 2, and anode terminals 5 and cathode terminals 6 which are respectively connected to the anode lead-out wires 4 and the cathode layers of the elements 2 and formed, so that the terminals 5 and 6 are partially exposed from the packaging resin 3 is manufactured. The anode terminals 5 are formed to have L-shaped cross sections and are positioned, so that the internal surfaces of the L-shaped cross sections become parallel to the side faces of the elements 2, to which the wires 4 are led out from the bottom faces of the elements 2. The capacitor elements 2 are mounted after a liquid material 29, containing an electrical insulating resin 9, has been applied to the internal corner sections of the L-shaped cross sections, and the material 29 is solidified.
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