发明名称 FLEXIBLE WIRING CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a flexible wiring circuit board which is provided with a connection terminal in which no insulation failure occur even if electricity is turned on in high-temperature and high-moisture environment for a long time, and a method for manufacturing the flexible wiring circuit board. SOLUTION: First a conductor layer 11 having an irregular surface is prepared, and an insulation layer 12 is laminated on the surface of the conductor layer 11. Next the conductor layer 11 is etched to form a specified pattern, and an open insulation protection layer 17 is formed in a manner to expose an edge 15 of the conductor layer 11 as a connection terminal 16, and then a nickel plating layer 20 and a gold plating layer 21 are formed in sequence on the edge 15 thereof. Thus, the surface irregular shape of the conductor layer 11 is transferred to the surface of the insulation layer 12, and the nickel plating layer 20 is inserted into the surface of the transferred insulation layer 12. Therefore, when the gold plating layer 21 is formed, a gold plating liquid can be prevented from entering a contact part 22 of the nickel plating layer 21.
申请公布号 JP2002185133(A) 申请公布日期 2002.06.28
申请号 JP20000380138 申请日期 2000.12.14
申请人 NITTO DENKO CORP 发明人 MOTOGAMI MITSURU;WAKAGI SHUICHI;MIYAKE YASUFUMI
分类号 H05K3/38;H05K3/24;(IPC1-7):H05K3/38 主分类号 H05K3/38
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