发明名称 METHOD FOR MANUFACTURING MULTILAYER FLEXIBLE CIRCUIT BOARD
摘要 PURPOSE: A method for manufacturing a multilayer flexible circuit board is provided to easily laminate layers on the board by accurately positioning the board of the layers. CONSTITUTION: In the method for manufacturing the multilayer flexible circuit board, an exposure mask is prepared, in which a plurality of pattern holes corresponding to the board of the layers of the multilayer flexible circuit board are arranged in a direction perpendicular to a conveying direction(P) of a base(2). A plurality of wiring patterns(3) corresponding to the board of the layer of the multilayer flexible circuit board is then formed on the same base(2) by using the exposure mask.
申请公布号 KR20020050720(A) 申请公布日期 2002.06.27
申请号 KR20010081614 申请日期 2001.12.20
申请人 SONY CHEMICALS CORPORATION 发明人 KANEDA YUTAKA
分类号 H05K1/00;H05K3/00;H05K3/06;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/00
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