发明名称 |
METHOD FOR MANUFACTURING MULTILAYER FLEXIBLE CIRCUIT BOARD |
摘要 |
PURPOSE: A method for manufacturing a multilayer flexible circuit board is provided to easily laminate layers on the board by accurately positioning the board of the layers. CONSTITUTION: In the method for manufacturing the multilayer flexible circuit board, an exposure mask is prepared, in which a plurality of pattern holes corresponding to the board of the layers of the multilayer flexible circuit board are arranged in a direction perpendicular to a conveying direction(P) of a base(2). A plurality of wiring patterns(3) corresponding to the board of the layer of the multilayer flexible circuit board is then formed on the same base(2) by using the exposure mask. |
申请公布号 |
KR20020050720(A) |
申请公布日期 |
2002.06.27 |
申请号 |
KR20010081614 |
申请日期 |
2001.12.20 |
申请人 |
SONY CHEMICALS CORPORATION |
发明人 |
KANEDA YUTAKA |
分类号 |
H05K1/00;H05K3/00;H05K3/06;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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