ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE

摘要

A method of manufacturing an electronic device capable of increasing the strength and the stability of the mechanical connection of the connection electrodes of an electronic component with the conductor pattern of a mounting substrate with a simple configuration and a simple process without affecting the operation of the electronic component, comprising the steps of disposing the electronic component (13) and the mounting substrate (11) so that one face (13a) of the electronic component (13) is opposed to one face (11a) of the mounting substrate (11), electrically and mechanically connecting the connection electrodes (14) of the electronic component (13) to the conductor pattern (12) of the mounting substrate (11), disposing a resin film (15) on the electronic component (13) and the mounting substrate (11), sucking air on the electronic component (13) side from the opposite side of the electronic component (13) on the mounting substrate (11) through a hole (31) formed in the mounting substrate (11) to vary the shape of the resin film (15) for fitting to the electronic component (13) and the mounting substrate (11), and heating the resin film (15) for adhering to the mounting substrate (11).