| 摘要 |
<p>An electronic circuit device capable of preventing heat and pressure of resin from being applied to mounted electronic components when a circuit board with the electronic components mounted thereon is encapsulated with the resin. A circuit board (10) with electronic components (11) and ICs (12) mounted thereon is accommodated in a sleeve formed of a heat-shrinkable film (16), the heat-shrinkable film (16) is shrunk by heat and intermediately packaged. The whole package including the circuit substrate (10) is encapsulated with the resin (17).</p> |
