发明名称 COMPOSITE PLATING FILM AND A PROCESS FOR FORMING THE SAME
摘要 <p>A composite nickel and copper alloy plating film (3) containing nickel and copper. Nickel is of high wear resistance and a nickel alloy improves the wear resistance of the film. Copper is of high resistance of the film. The film may further contain self-lubricating particles and hard particles which ensure its wear resistance and lubricating property to a further extent.</p>
申请公布号 WO2002050342(A2) 申请公布日期 2002.06.27
申请号 JP2001010894 申请日期 2001.12.12
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