Apparatus for connecting a semiconductor die to a substrate and method therefor

摘要

A pad area of a substrate (50) includes a conductive trace (52) formed on the substrate (50) having a first surface area, the first surface area being of a first solderability. A conductive pad (56) is formed on the first surface area of the conductive trace (52). The conductive pad (56) has a second surface area, the second surface area being of a second solderability. The second solderability is greater than the first solderability. Because of the different solderabilities, a solder bump (46) on the semiconductor die (40) can be reflowed and connected to the second surface area without using a soldermask (28) to contain the melted solder on the second surface area.