| 摘要 |
<p>An apparatus has a bath system (12) comprising an input bath compartment (31), a first intermediate bath compartment (32), a heating bath compartment (33), a second intermediate bath compartment (34), and an output bath compartment (35) stored with a liquid (13) used as a heating medium, partitioned by gates (21 24), in order, and arranged in the direction where a printed board assembly (11) on which components are mounted is moved. The temperatures of the liquids (13 31, 13-32) in the input bath compartment (31) and in the first intermediate bath compartment (32) are a preheating temperature. The temperature of the liquid (13-33) in the heating bath compartment (33) is a soldering temperature. When the printed board stays in the first intermediate bath compartment (32) before transferred to the heating bath compartment (33), the gate (21) is gradually opened. The liquid in the heating bath compartment (33) mixes with the liquid in the first intermediate bath compartment (32), and the temperature of the liquid in the first intermediate bath compartment (32) gradually rises to the soldering temperature. The temperature of the printed board assembly (11) is gradually raised from the preheating temperature to the soldering temperature.</p> |
