PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING THE SAME, METHOD FOR STACKING PHOTOSENSITIVE RESIN COMPOSITION LAYER, PHOTOSENSITIVE RESIN COMPOSITION LAYER STACKED SUBSTRATE AND METHOD FOR CURING PHOTOSENSITIVE RESIN COMPOSITION LAYER

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition less liable to contaminate a plating solution because the leaching of a photopolymerization initiator in the plating solution is hardly caused and to provide a photosensitive element. SOLUTION: The photosensitive resin composition contains (A) two or more polymers having carboxyl groups, (B) a polymerizable compound having at least one unsaturated bond and (C) a photopolymerization initiator and contains hexaarylbiimidazole as the component (C).