CARRIER FILM FOR MOLDING CERAMIC SHEET

摘要

PROBLEM TO BE SOLVED: To provide a carrier film for molding a ceramic sheet reduced in heat shrinkage and excellent in the releasability of the ceramic sheet. SOLUTION: The release layer containing curable silicone as a main constituent is provided on one surface of a polyester film and the difference between the dynamic hardness DH (A) of the ceramic sheet laminated on the surface of the release layer and the dynamic hardness DH (B) of the release layer is within a range of formula (1):|DH (A)-DH (B)|<=20 (gf/μm2) and the heat shrinkage factor HS in the maximum shrink direction at 150 deg.C×30 min is within a range of formula (2): 0.3%<=HS<=1.2%.