CHIP SCALE PACKAGE INCLUDING BEAM LEADS

摘要

PURPOSE: A chip scale package including beam leads is provided to guarantee reliability while the size of a semiconductor chip is minimized, by forming center pads of different sizes with respect to the center portion and the end portions in a region where the center pads are disposed and by making the beam leads corresponding to the center pads have different widths. CONSTITUTION: The semiconductor chip(110) has an active surface(112) on which the center pads(120) are formed. The beam leads(140) correspondingly connected to the center pads are formed on the lower surface of a substrate(130). A window in which a part of the beam leads is exposed is formed, corresponding to the region where the center pads are formed. Ball pads in which an end of each beam lead is exposed as a lattice type are formed in the substrate. The substrate is attached to the semiconductor chip by elastomer(150) which is interposed between the active surface and the lower surface of the substrate except the region where the center pads are formed. Outer connection terminals(170) are respectively formed on the ball pads. The center pads are of different sizes. The beam leads have different types, corresponding to the size of the center pads.