发明名称 |
METHOD FOR FABRICATING SEMICONDUCTOR, METHOD FOR FABRICATING SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR LIGHT EMITTING DEVICE |
摘要 |
PURPOSE: A method for fabricating semiconductor, a method for fabricating semiconductor substrate, and a semiconductor light emitting device are provided to ensure that no cracking or the like occurs particularly in a semiconductor layer having a small lattice constant among a plurality of layered semiconductor layers made of group III-V nitrides. CONSTITUTION: In a structure using a substrate made of a material different from a group III-V nitride, the lattice constant of a semiconductor layer having a comparatively small lattice constant among a plurality of semiconductor layers grown on the substrate, that is, a semiconductor layer containing aluminum, is made to substantially match with the lattice constant of a strain suppression layer at room temperature after thermal shrinkage or thermal expansion. |
申请公布号 |
KR20020050174(A) |
申请公布日期 |
2002.06.26 |
申请号 |
KR20010081558 |
申请日期 |
2001.12.20 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
ISHIBASHI AKIHIKO;KAWAGUCHI YASUTOSHI;OHNAKA KIYOSHI;OTSUKA NOBUYUKI;TSUJIMURA AYUMU |
分类号 |
H01L21/20;H01L33/00;H01L33/32;(IPC1-7):H01L33/00 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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