发明名称 METHOD FOR FABRICATING SEMICONDUCTOR, METHOD FOR FABRICATING SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要 PURPOSE: A method for fabricating semiconductor, a method for fabricating semiconductor substrate, and a semiconductor light emitting device are provided to ensure that no cracking or the like occurs particularly in a semiconductor layer having a small lattice constant among a plurality of layered semiconductor layers made of group III-V nitrides. CONSTITUTION: In a structure using a substrate made of a material different from a group III-V nitride, the lattice constant of a semiconductor layer having a comparatively small lattice constant among a plurality of semiconductor layers grown on the substrate, that is, a semiconductor layer containing aluminum, is made to substantially match with the lattice constant of a strain suppression layer at room temperature after thermal shrinkage or thermal expansion.
申请公布号 KR20020050174(A) 申请公布日期 2002.06.26
申请号 KR20010081558 申请日期 2001.12.20
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 ISHIBASHI AKIHIKO;KAWAGUCHI YASUTOSHI;OHNAKA KIYOSHI;OTSUKA NOBUYUKI;TSUJIMURA AYUMU
分类号 H01L21/20;H01L33/00;H01L33/32;(IPC1-7):H01L33/00 主分类号 H01L21/20
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